Rediseño del SIPCP para el módulo de CAM (Módulo de Ensamble de Componentes) en la fábrica de ensamble y prueba de Intel Costa Rica.

By: Contributor(s): Material type: TextTextPublication details: San Jose, Costa Rica : N. Alvarado, 2012.Description: 136 p. : 28 cmSubject(s): DDC classification:
  • TCD 5013
Dissertation note: Tesina Ingeniería Industrial / Bachillerato Ingeniería Industrial / Tutor Ing. Eugenio Grant Mora / Lector Ing. William Delgado Aguilar / TCD 5013
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Holdings
Item type Current library Call number Status Date due Barcode
TFG en CD TFG en CD Biblioteca Sede Central San José TCD 5013 (Browse shelf(Opens below)) Available 042155

Tesina Ingeniería Industrial /

Bachillerato Ingeniería Industrial /

Tutor Ing. Eugenio Grant Mora /

Lector Ing. William Delgado Aguilar /

TCD 5013

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